Custom Product Development

Electrical Engineering 
  • Digital Design:

    • uProc architectures ( 8bit-32bit, Microchip, ST, ATM, TI, etc…)

    • Multi OS: RTOS, Linux, Android

  • Analog Design:

    • Power distribution (LDO, Buck, Boost)

    • Gesture recognition circuit

    • Multi-sensors (ToF, Gyro, Magnetic, Pressure, Temp..)

  • Display Technologies

    • OLED, TFT, LCDTouchscreen

  • RF/Wireless Design:

    • Wi-Fi, BLE, GPS & Telematics

    • Passive Entry/Passive Start (PEPS) & RFID (LF, HF and UHF)

PCB Design
  • High Complexity Design:

    • 3 mil spacing / 2.7 mil traces

  • Finest Pitch Design Capable

    • 01005 SMD / BGA with 8.7 mil pads

  • Up to 18” x 13” CCAs

  • Impedance Matching

    • Multi-band RF circuits

    • High Power/High Current tracing

Mechanical Engineering 
  • Specialize in sealed harsh environment enclosures (IP67, IP69K)

  • Utilize extensive in-house 3D printers for mechanical PCB design

  • Proficient designing parts for

    • Machining

    • Injection molding

    • Casting

    • Metal forming

  • Overlays – graphics, material and adhesive selection

  • Optics & Lensing for IR applications

  • Component research and selection

  • Thermal management (specifically at the PCB level)

Software Engineering 
  • Languages:

    • C, C++, C#

    • PHP

    • Java

  • Environments/OS

    • Windows

    • Linux

    • Embedded (FreeRTOS)

    • Android

    • iOS

    • CAN Bus

  
© 2019  |  Riverside Mfg., LLC  |  All rights reserved worldwide 

14510 Lima Rd

Fort Wayne, Indiana 46818

Phone: 260-637-4470