Harsh Environment Electrical Solutions

Custom Product Development

Electrical Engineering 

• Digital Design:

  • uProc architectures ( 8bit-32bit, Microchip, ST, ATM, TI, etc…)

  • Multi OS: RTOS, Linux, Android

• Analog Design:

  • Power distribution (LDO, Buck, Boost)

  • Gesture recognition circuit

  • Multi-sensors (ToF, Gyro, Magnetic, Pressure, Temp..)

• Display Technologies

  • OLED, TFT, LCD, Touchscreen

• RF/Wireless Design:

  • Wi-Fi, BLE, GPS & Telematics

  • Passive Entry/Passive Start (PEPS) & RFID (LF, HF and UHF)

PCB Design

• High Complexity Design:

  • 3 mil spacing / 2.7 mil traces

• Finest Pitch Design Capable

  • 01005 SMD / BGA with 8.7 mil pads

• Up to 18” x 13” CCAs

• Impedance Matching

  • Multi-band RF circuits

  • High Power/High Current tracing

Mechanical Engineering 

• Specialize in sealed harsh environment enclosures (IP67, IP69K)

• Utilize extensive in-house 3D printers for mechanical PCB design

• Proficient designing parts for

  • Machining

  • Injection molding

  • Casting

  • Metal forming

• Overlays – graphics, material and adhesive selection

• Optics & Lensing for IR applications

• Component research and selection

• Thermal management (specifically at the PCB level)

Software Engineering 

• Languages:

  • C, C++, C#

  • PHP

  • Java

• Environments/OS

  • Windows

  • Linux

  • Embedded (FreeRTOS)

  • Android

  • iOS

  • CAN Bus