Custom Product Development



Electrical Engineering
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Digital Design:
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uProc architectures ( 8bit-32bit, Microchip, ST, ATM, TI, etc…)
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Multi OS: RTOS, Linux, Android
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Analog Design:
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Power distribution (LDO, Buck, Boost)
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Gesture recognition circuit
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Multi-sensors (ToF, Gyro, Magnetic, Pressure, Temp..)
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Display Technologies
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OLED, TFT, LCD, Touchscreen
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RF/Wireless Design:
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Wi-Fi, BLE, GPS & Telematics
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Passive Entry/Passive Start (PEPS) & RFID (LF, HF and UHF)
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PCB Design
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High Complexity Design:
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3 mil spacing / 2.7 mil traces
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Finest Pitch Design Capable
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01005 SMD / BGA with 8.7 mil pads
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Up to 18” x 13” CCAs
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Impedance Matching
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Multi-band RF circuits
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High Power/High Current tracing
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Mechanical Engineering
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Specialize in sealed harsh environment enclosures (IP67, IP69K)
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Utilize extensive in-house 3D printers for mechanical PCB design
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Proficient designing parts for
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Machining
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Injection molding
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Casting
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Metal forming
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Overlays – graphics, material and adhesive selection
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Optics & Lensing for IR applications
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Component research and selection
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Thermal management (specifically at the PCB level)
Software Engineering
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Languages:
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C, C++, C#
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PHP
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Java
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Environments/OS
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Windows
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Linux
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Embedded (FreeRTOS)
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Android
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iOS
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CAN Bus
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